In-line packaging (also called dual in-line packaging, or DI pouches) is a cost-saving design alternative for many electronic devices. This type of packaging involves arranging components with the same type, size, and orientation all the time. In-line packaging has several advantages over other PCB design methods.
It helps reduce production costs and reduces cycle times by minimizing handling and operator interaction. You can also optimize assembly efficiency by keeping boards within specified dimensions. This article highlights some of the best practices when designing DIP Assembly for PCB board assembly. Keep reading to learn more about it!
Specify board dimensions before designing
When you design dual in-line packages, you ideally want to keep boards within specific dimensions. With this in mind, you can use board geometry software to simulate the size of your boards and the dimensions of your equipment. Then, you can optimize the board layout to fit the equipment. In addition to board dimensions, you also need to consider the capacity of your equipment.
For example, a chemical developer requires a certain capacity to produce certain volumes per cycle. A smaller capacity may not be enough to meet your needs. However, if you increase the capacity, the capacity per cycle decreases, which may create additional production costs.
Pre-plan assembly operation steps
If you design dual in-line packages with no pre-planning, you may not exactly run your equipment as designed. Now, if the capacity of your equipment is not sufficient to handle boards within certain dimensions, then you’ll need to adjust or redesign equipment to accommodate the boards. A pre-planning process also allows you to consider the assembly operation steps for your boards. If you plan to stick boards on a conveyor, for example, then you should design the conveyor system accordingly.
The most common assembly operation steps for dual in-line packages are stacking, daisy chain, and transfer. First, stacking is the act of placing components on top of each other. In dual in-line packaging, components are stacked with their contacts facing inwards. You can use pins or tabs to connect components. Next, daisy chain is another common aspect of assembly. It involves routing components within a stack so that they are connected in parallel.
Use automated board placement and detection systems
Many manufacturing equipment manufacturers offer automated board placement and detection systems for dual in-line packages. If your board production equipment is not equipped with such systems, then you’ll have to manually place and detect boards on equipment. You can use such systems to save time, reduce manual errors, and avoid damaging components. For example, you can use an automated system to place components on a stack. Then, you can place and detect each assembled board manually.
Using automated systems for dual in-line packages also has several other benefits. First, if you are running a high-throughput manufacturing line, then automated board placement systems can greatly reduce human interaction. Second, you can also optimize your production line with automated systems. For example, you can place components in vertical columns or rows. You can also configure equipment so that components are placed in the most efficient way, based on their orientation.
Use in-line labeling to identify the orientation and package contents
Labeling your components with relevant information can greatly improve SDD. To label components, you can use in-line labels. In-line labels are attached to components before they reach the assembly line. Therefore, labeling is done during the inspection process. By labeling components, you can help operators identify the components and their orientation, package type, and package contents.
For example, if you design dual in-line packages for PCB assembly, you can use labels to indicate the orientation of components. This helps with operator orientation while they are assembling boards. You can also use labels to identify components and their contents. For example, you can use labels to identify components and their package type, such as resistors, capacitors, etc. You can also use labels to identify other components, such as integrated circuits, connectors, or other passive components.
TIP: Print package label on the top side
When designing dual in-line packages, you can print the package label on the top side of the carton. This way, you can apply the top label to the carton during shipping. By printing the label on the top side, you enable the carton to flip open during shipping. This helps with orientation and positioning during shipping. This way, the package label also helps with the inspection. By reading the information on the top side of the package, you can easily inspect components. If you print the package label on the top side, you also enable the carton to open during the inspection. By doing so, you can inspect the package label easily.
Inspect and test dual in-line packages during the assembly process
Now, you have designed and manufactured your boards. You have to assemble them and test the finished products. During the assembly process, you can test the boards by using a PCB inspection system to inspect the boards. With this system, you can check for defects and missing components, etc. You can also test the dual in-line packages during the assembly process. With such a system, you can check for orientation and misalignment. You can also test the contents of components.
This way, you can quickly find any defects or missing components. In dual in-line packaging, you need to check for misalignment and orientation of components. This can help with detection and inspection during assembly. There are several inspection systems for dual in-line packages for PCB board assembly. One such system is the automated vision system. With this system, you can check for components’ orientation and position. With the system, you can view the layout of components on a computer screen. Then, you can use a pair of binoculars to view the assembled board. By using the inspection system, you can also detect incorrect components quickly. For example, if a specific component is not in the board, then the system can help you detect the problem.
Final Words
Dual in-line packages are cost-saving, high-throughput electronic components for PCB board assembly. When designing dual in-line packages, you can use board geometry software to simulate the size of your boards and the dimensions of your equipment. Then, you can optimize the board layout to fit the equipment. To further maximize the benefits of dual in-line packages, you should also use automated board placement and detection systems during the assembly process. Furthermore, you should inspect and test dual in-line packages during the assembly process.